Seiichi Akagi

City:

Chikusei

Country:

Japan

Published Applications:

Last publication date:

2008-09-25

Top Assignees for applications by Seiichi Akagi

The entities that hold a legal rights for patent applications filed by inventor Akagi Seiichi:

Seiichi Akagi from Chikusei, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Sealant epoxy-resin molding material, and electronic component device

InventorID:

6205915 ⎘