Yousuke Oyama

City:

Ohbu

Country:

Japan

Published Applications:

Last publication date:

2008-09-11

Top Assignees for applications by Yousuke Oyama

The entities that hold a legal rights for patent applications filed by inventor Oyama Yousuke:

Yousuke Oyama from Ohbu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Filling method and filling apparatus of powder-particle material in compression molding

InventorID:

6208893 ⎘