• Recent
  • Class
  • Inventors
  • Assignees
  • Top Lists
  • Pricing
  • Account
Patents-Review.com
  1. Home
  2. Inventor
  3. C
  4. Cis…
  5. Cisek Ken
🔗 Permalink
Inventor profile of:

Ken Cisek

City:

Chicago, Illinois

Country:

United States

Published Applications:

5

Last publication date:

2014-01-23

Top Assignees for applications by Ken Cisek

The entities that hold a legal rights for patent applications filed by inventor Cisek Ken:

  • The Glad Products Company 5 Oakland, CA United States

Recent patent applications by Cisek Ken

Ken Cisek from Chicago, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-01-23
US20140023829A1
Performing operations; transporting

Multi-ply puckered films formed by discontinuous lamination of films having different rebound ratios

#2 | 2012-06-28
US20120163738A1
Performing operations; transporting

Multi-layered bags with shortened inner layer

#3 | 2012-05-31
US20120134606A1
Performing operations; transporting

Non-continuously laminated multi-layered bags with ribbed patterns and methods of forming the same

#4 | 2012-03-15
US20120064271A1
Performing operations; transporting

Multi-layered lightly-laminated films and methods of making the same

#5 | 2012-02-16
US20120039550A1
Performing operations; transporting

Incrementally-stretched adhesively-laminated films and methods for making the same

InventorID:

622459 ⎘

  1. Home
  2. Inventor
  3. C
  4. Cis…
  5. Cisek Ken

Some parts © 2022-2026 Patents-Review.com

Browse & Discovery
  • Home
  • Patent Classification
  • Inventor Index
  • Assignee Index
  • Interesting Applications
Search & Tools
  • Basic Search
  • Advanced Search
  • Patent Alerts
  • Top Lists
  • Statistics
Information & Resources
  • About US Patent System
  • Terms & Privacy
  • Pricing
  • Contact
Quick Access
  • Latest Applications
  • Top Inventors 2026
  • Top Assignees 2026
  • Featured Patents
Disclaimer: This website is intended for informational purposes only, and its content is based on public patent records. Please note that some sections of this website have been created or processed using machine learning models. We provide content in good faith but make no guarantees regarding accuracy or completeness. By using this site, you accept any risks and waive claims against us for errors or omissions.