Inventor profile of:

Yusuke Taguchi

City:

Annaka

Country:

Japan

Published Applications:

13

Last publication date:

2013-11-28

Top Assignees for applications by Yusuke Taguchi

The entities that hold a legal rights for patent applications filed by inventor Taguchi Yusuke:

Recent patent applications by Taguchi Yusuke

Yusuke Taguchi from Annaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-11-28
US20130312906A1
Electricity

Surface-mount light emitting device

#2 | 2011-10-06
US20110241048A1
Electricity

Resin composition, reflector for light-emitting semiconductor device, and light-emitting semiconductor unit

#3 | 2011-03-17
US20110065872A1
Electricity

Underfill composition and an optical semiconductor device

#4 | 2011-03-03
US20110054072A1
Chemistry; metallurgy

White heat-curable silicone/epoxy hybrid resin composition for optoelectronic use, making method, premolded package, and LED device

#5 | 2010-10-28
US20100273927A1
Chemistry; metallurgy

Silicone resin composition for optical semiconductor devices and an optical semiconductor device

#6 | 2010-06-17
US20100148380A1
Chemistry; metallurgy

Thermosetting epoxy resin composition and semiconductor device

#7 | 2010-05-20
US20100125116A1
Chemistry; metallurgy

Heat-curable resin composition

#8 | 2010-04-01
US20100081748A1
Electricity

Silicone resin composition for optical semiconductor devices

#9 | 2010-01-07
US20100001311A1
Electricity

Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same

#10 | 2009-12-10
US20090306263A1
Chemistry; metallurgy

White heat-curable silicone resin composition and optoelectronic part case

#11 | 2009-12-10
US20090304961A1
Chemistry; metallurgy

White heat-curable silicone resin composition and optoelectronic part case

#12 | 2009-09-24
US20090239997A1
Chemistry; metallurgy

White thermosetting silicone resin composition for molding an optical semiconductor case and optical semiconductor case

#13 | 2009-07-02
US20090171013A1
Chemistry; metallurgy

White heat-curable silicone resin composition, optoelectronic part case, and molding method

InventorID:

6229492 ⎘