Tianjin
China
11
2025-07-03
The entities that hold a legal rights for patent applications filed by inventor LI Jun:
Jun LI from Tianjin, CN has applied for patents for these inventions. The list has both pending applications and granted patents:
HYBRID BALL/BUMP AND WIREBOND SEMICONDUCTOR DEVICE PACKAGING
#2 | 2024-09-26SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND LEAD FRAME
#3 | 2022-12-29Lead-frame assembly, semiconductor package and methods for improved adhesion
#4 | 2022-12-15Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package
#5 | 2020-06-25Lead frame with selective patterned plating
#6 | 2019-02-26Lead frame for integrated circuit device having J-leads and Gull Wing leads
#7 | 2016-07-07Lightweight mop and mop bucket used therewith
#8 | 2014-07-03Multi-level sliding sleeve
#9 | 2014-01-23SEMICONDUCTOR WAFER DICING METHOD
#10 | 2012-08-23MRAM device and method of assembling same
#11 | 2012-08-02MRAM DEVICE AND METHOD OF ASSEMBLING SAME
623022 ⎘