Hiroaki Ikeba

City:

Oyama

Country:

Japan

Published Applications:

Last publication date:

2009-12-31

Top Assignees for applications by Hiroaki Ikeba

The entities that hold a legal rights for patent applications filed by inventor Ikeba Hiroaki:

Hiroaki Ikeba from Oyama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Epoxy resin molding material for sealing and electronic component device

InventorID:

6239404 ⎘