Hsinchu
Taiwan
3
2023-01-26
The entities that hold a legal rights for patent applications filed by inventor Yang Tsung-Fu:
Tsung-Fu Yang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device having a 2-D material layer including a channel region and source/drain regions and method for forming the same
#2 | 2012-07-05Three dimensional stacked chip package structure
#3 | 2011-01-27Sealed joint structure of device and process using the same
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