Takuya Hando

City:

Inuyama

Country:

Japan

Published Applications:

Last publication date:

2013-06-27

Top Assignees for applications by Takuya Hando

The entities that hold a legal rights for patent applications filed by inventor Hando Takuya:

Takuya Hando from Inuyama, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of manufacturing multi-layer wiring board

Multilayer wiring board

Multilayer wiring board

Multilayered wiring substrate

Method of manufacturing multilayer wiring substrate

Multilayer wiring substrate and method for manufacturing the same

Wiring board having solder bump and method for manufacturing the same

InventorID:

6247467 ⎘