Hirohito Watanabe

City:

Sakura

Country:

Japan

Published Applications:

Last publication date:

2015-11-26

Top Assignees for applications by Hirohito Watanabe

The entities that hold a legal rights for patent applications filed by inventor Watanabe Hirohito:

FUJIKURA LTD. 9 Tokyo, Japan

Recent patent applications by Watanabe Hirohito

Hirohito Watanabe from Sakura, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-11-26

US20150342030A1

Electricity

Printed wiring board

#2 | 2015-11-26

US20150340751A1

Electricity

Printed wiring board

#3 | 2013-06-27

US20130161077A1

Electricity

Differential signal transmission circuit and method for manufacturing same

#4 | 2013-04-11

US20130087370A1

Electricity

Method of manufacturing printed circuit board and printed circuit board

#5 | 2012-11-08

US20120279050A1

Electricity

Method for manufacturing printed wiring board

#6 | 2012-08-16

US20120205141A1

Electricity

Printed wiring board including first and second insulating layers having dielectric loss tangents that are different by a predetermined relationship

#7 | 2011-10-13

US20110247863A1

Electricity

Flexible printed board and method of manufacturing same

#8 | 2010-12-09

US20100307797A1

Electricity

Flexible printed circuit and method of manufacturing same

#9 | 2009-10-08

US20090250256A1

Electricity

Socket contact terminal and semiconductor device

InventorID:

6252069 ⎘