Daisuke Fujimoto

City:

Chikusei

Country:

Japan

Published Applications:

Last publication date:

2017-01-19

Top Assignees for applications by Daisuke Fujimoto

The entities that hold a legal rights for patent applications filed by inventor Fujimoto Daisuke:

Daisuke Fujimoto from Chikusei, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition

Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition

Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same

InventorID:

6265610 ⎘