JONG RIP KIM

City:

SUWON

Country:

Korea (South)

Published Applications:

Last publication date:

2015-12-03

Top Assignees for applications by JONG RIP KIM

The entities that hold a legal rights for patent applications filed by inventor KIM JONG RIP:

JONG RIP KIM from SUWON, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

PACKAGE SUBSTRATE, PACKAGE, PACKAGE ON PACKAGE AND MANUFACTURING METHOD OF PACKAGE SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing a flexible printed circuit board

METHOD OF MANUFACTURING A FLEXIBLE PRINTED CIRCUIT BOARD

Flexible printed circuit board and method of manufacturing the same

InventorID:

627075 ⎘