Inventor profile of:

Andreas Plöβl

City:

Regensburg

Country:

Germany

Published Applications:

16

Last publication date:

2021-12-09

Top Assignees for applications by Andreas Plöβl

The entities that hold a legal rights for patent applications filed by inventor Plöβl Andreas:

Recent patent applications by Plöβl Andreas

Andreas Plöβl from Regensburg, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-12-09
US20210384062A1
Electricity

Transfer tool and method for transferring semiconductor chips

#2 | 2017-09-21
US20170271438A1
Electricity

Method of producing semiconductor chips that efficiently dissipate heat

#3 | 2016-08-25
US20160247966A1
Electricity

Producing a light-emitting semiconductor component by connecting first and second semiconductor bodies

#4 | 2016-04-21
US20160111615A1
Electricity

Method for producing a plurality of optoelectronic semiconductor chips, and optoelectronic semiconductor chip

#5 | 2016-04-07
US20160099390A1
Electricity

Optoelectronic semiconductor component

#6 | 2016-01-28
US20160027959A1
Electricity

Method for producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

#7 | 2016-01-28
US20160027759A1
Electricity

Process for connecting joining parts

#8 | 2015-12-03
US20150345727A1
Mechanical engineering

Optoelectronic component and method for the production thereof

#9 | 2015-03-12
US20150070914A1
Mechanical engineering

Optoelectronic lighting device and method for producing an optoelectronic lighting device

#10 | 2015-02-19
US20150048400A1
Electricity

Method of producing an optoelectronic semiconductor chip

#11 | 2015-02-12
US20150041840A1
Electricity

Optoelectronic semiconductor component, and method for the manufacture of an optoelectronic semiconductor component

#12 | 2014-05-29
US20140145228A1
Electricity

Optoelectronic semiconductor chip, method of fabrication and application in an optoelectronic component

#13 | 2014-03-13
US20140070246A1
Electricity

Producing a light-emitting semiconductor component by connecting first and second semiconductor bodies

#14 | 2014-01-09
US20140008770A1
Electricity

Carrier substrate and method for producing semiconductor chips

#15 | 2011-09-29
US20110233784A1
Electricity

Composite substrate for a semiconductor chip

#16 | 2011-08-04
US20110186953A1
Electricity

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

InventorID:

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