Daisuke Shimiya

City:

Ichihara

Country:

Japan

Published Applications:

Last publication date:

2019-10-10

Top Assignees for applications by Daisuke Shimiya

The entities that hold a legal rights for patent applications filed by inventor Shimiya Daisuke:

Daisuke Shimiya from Ichihara, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Latex composition and one-pack type aqueous adhesive composed of said latex composition

Binder composition for electrode

Acrylic rubber

InventorID:

6279820 ⎘