Windham, New Hampshire
United States
8
2015-04-16
The entities that hold a legal rights for patent applications filed by inventor Goida Thomas:
Thomas Goida from Windham, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Pre-molded MEMS device package with conductive shell
#2 | 2014-11-13Packages and methods for packaging
#3 | 2014-01-30Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die
#4 | 2012-09-20Packages and methods for packaging MEMS microphone devices
#5 | 2012-05-24Packages and methods for packaging using a lid having multiple conductive layers
#6 | 2012-02-02Reduced footprint microphone system with spacer member having through-hole
#7 | 2008-08-21DIE COAT PERIMETER TO ENHANCE SEMICONDUCTOR RELIABILITY
#8 | 2008-07-24Stress free package and laminate-based isolator package
627993 ⎘