Inventor profile of:

Mitsuhiro Tanaka

City:

Tsukuba

Country:

Japan

Published Applications:

11

Last publication date:

2014-02-13

Top Assignees for applications by Mitsuhiro Tanaka

The entities that hold a legal rights for patent applications filed by inventor Tanaka Mitsuhiro:

Recent patent applications by Tanaka Mitsuhiro

Mitsuhiro Tanaka from Tsukuba, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-02-13
US20140042451A1
Electricity

Semiconductor device, HEMT device, and method of manufacturing semiconductor device

#2 | 2013-07-18
US20130181327A1
Electricity

Epitaxial substrate for semiconductor device, method for manufacturing epitaxial substrate for semiconductor device, and semiconductor device

#3 | 2013-07-04
US20130168734A1
Electricity

Epitaxial substrate for semiconductor device, semiconductor device, method of manufacturing epitaxial substrate for semiconductor device, and method of manufacturing semiconductor device

#4 | 2013-05-30
US20130134439A1
Electricity

Epitaxial substrate for semiconductor element, semiconductor element, PN junction diode, and method for manufacturing an epitaxial substrate for semiconductor element

#5 | 2013-04-18
US20130092953A1
Electricity

Epitaxial substrate and method for manufacturing epitaxial substrate

#6 | 2013-02-21
US20130043488A1
Electricity

Epitaxial substrate and method for manufacturing epitaxial substrate

#7 | 2013-02-07
US20130032781A1
Chemistry; metallurgy

Epitaxial substrate comprising a superlattice group and method for manufacturing the epitaxial substrate

#8 | 2013-01-31
US20130026488A1
Electricity

Epitaxial substrate and method for manufacturing epitaxial substrate

#9 | 2013-01-17
US20130015466A1
Electricity

Epitaxial substrate for semiconductor device and semiconductor device

#10 | 2012-08-23
US20120211765A1
Electricity

Epitaxial substrate for semiconductor element, semiconductor element, and method for producing epitaxial substrate for semiconductor element

#11 | 2012-06-28
US20120161152A1
Electricity

Epitaxial substrate with intermediate layers for reinforcing compressive strain in laminated composition layers and manufacturing method thereof

InventorID:

6284170 ⎘