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Inventor profile of:

Minoru UESHIMA

City:

TOKYO

Country:

Japan

Published Applications:

Last publication date:

2021-11-25

Top Assignees for applications by Minoru UESHIMA

The entities that hold a legal rights for patent applications filed by inventor UESHIMA Minoru:

SENJU METAL INDUSTRY CO., LTD 14 Tokyo, Japan
OSAKA UNIVERSITY 3 Osaka, Japan
MITSUBISHI ELECTRIC CORPORATION 1 TOKYO, Japan
Mitsubishi Electric Corporation 1 Chiyoda-ku, Japan
SENJUMETAL INDUSTRY CO., LTD. 1 Tokyo, Japan
Senju Metal Industry Co., Ltd. 1 Adachi-ku, Japan

Recent patent applications by UESHIMA Minoru

Minoru UESHIMA from TOKYO, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2021-11-25

US20210366627A1

Electricity

Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

#2 | 2021-01-14

US20210008670A1

Performing operations; transporting

Solder alloy for power devices and solder joint having a high current density

#3 | 2020-12-03

US20200381136A1

Electricity

Method for synthesizing copper-silver alloy, method for forming conduction part, copper-silver alloy, and conduction part

#4 | 2020-09-10

US20200284282A1

Mechanical engineering

Soldered joint and method for forming soldered joint

#5 | 2019-12-26

US20190393188A1

Electricity

Metallic sintered bonding body and die bonding method

#6 | 2018-09-20

US20180264601A1

Performing operations; transporting

Solder alloy and module

#7 | 2017-01-19

US20170014955A1

Performing operations; transporting

Solder alloy, and LED module

#8 | 2016-01-14

US20160010179A1

Chemistry; metallurgy

Electroconductive bonding material

#9 | 2015-08-06

US20150217410A1

Performing operations; transporting

High-temperature lead-free solder alloy

#10 | 2014-04-24

US20140112710A1

Performing operations; transporting

Solder Alloy for Power Devices and Solder Joint Having a High Current Density

#11 | 2014-01-30

US20140029224A1

Electricity

Method of mounting electronic component to circuit board

#12 | 2013-05-16

US20130121874A1

Performing operations; transporting

Bi—Sn based high-temperature solder alloy

#13 | 2011-08-25

US20110204121A1

Performing operations; transporting

Lead-free solder alloy having reduced shrinkage cavities

#14 | 2011-04-21

US20110089568A1

Electricity

Power semiconductor device and manufacturing method therefor

InventorID:

629632 ⎘