Shu Dobashi

City:

Joetsu

Country:

Japan

Published Applications:

Last publication date:

2007-07-19

Top Assignees for applications by Shu Dobashi

The entities that hold a legal rights for patent applications filed by inventor Dobashi Shu:

ARISAWA MFG. CO., LTD. 1 Joetsu-shi, Japan

Recent patent applications by Dobashi Shu

Shu Dobashi from Joetsu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2007-07-19

US20070166559A1

Chemistry; metallurgy

Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin composition

InventorID:

6301432 ⎘