Wei-Chung Yang

City:

Pingzhen

Country:

Taiwan

Published Applications:

Last publication date:

2012-12-06

Recent patent applications by Yang Wei-Chung

Wei-Chung Yang from Pingzhen, TW has applied for patents for these inventions. The list has both pending applications and granted patents:

Interposer and manufacturing method thereof

Capacitive coupler packaging structure

Power module and the method of packaging the same

Chip package and method for forming the same

InventorID:

6310155 ⎘