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Inventor profile of:

Hiroshi Imai

City:

Sendai

Country:

Japan

Published Applications:

1

Last publication date:

2011-05-12

Top Assignees for applications by Hiroshi Imai

The entities that hold a legal rights for patent applications filed by inventor Imai Hiroshi:

NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY 1 Miyagi, Japan
Foundation for Advancement of International Science 1 Ibaraki, Japan

Recent patent applications by Imai Hiroshi

Hiroshi Imai from Sendai, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2011-05-12

US20110110052A1

Multilayer wiring board

InventorID:

6312581 ⎘