Daisuke Awaji

City:

Sakura

Country:

Japan

Published Applications:

Last publication date:

2019-06-20

Top Assignees for applications by Daisuke Awaji

The entities that hold a legal rights for patent applications filed by inventor Awaji Daisuke:

Daisuke Awaji from Sakura, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Wiring substrate and method for manufacturing said wiring substrate

Sensor head and optical sensor

Method for manufacturing optical module

InventorID:

6331250 ⎘