Akihiro Masuda

City:

Sanda

Country:

Japan

Published Applications:

Last publication date:

2015-02-05

Top Assignees for applications by Akihiro Masuda

The entities that hold a legal rights for patent applications filed by inventor Masuda Akihiro:

MITSUBISHI MATERIALS CORPORATION 4 Tokyo, Japan
NIPPON PILLAR PACKING CO., LTD. 3 Osaka-shi, Osaka, Japan
Nippon Pillar Packing Co., Ltd. 2 Osaka-shi, Japan
NIPPON PILLAR PACKAGING CO., LTD. 1 Osaka-Shi, Japan

Recent patent applications by Masuda Akihiro

Akihiro Masuda from Sanda, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-02-05

US20150034489A1

Chemistry; metallurgy

Method of electroplating with Sn-alloy and apparatus of electroplating with Sn-alloy

#2 | 2014-05-08

US20140127109A1

Chemistry; metallurgy

Tin(II) oxide powder for replenishing tin component of tin-alloy plating solution and method for manufacturing said powder

#3 | 2014-03-20

US20140079618A1

Chemistry; metallurgy

Method for manufacturing tin(II) oxide powder for replenishing tin component of tin-alloy plating solution, and tin (II) oxide powder manufactured using said method

#4 | 2013-11-21

US20130309862A1

Electricity

Method for manufacturing Sn alloy bump

#5 | 2011-10-27

US20110260450A1

Mechanical engineering

Resin pipe joint

#6 | 2011-09-15

US20110221190A1

Mechanical engineering

Resinous pipe joint

#7 | 2011-09-01

US20110210544A1

Mechanical engineering

Resinous tube joint

InventorID:

6336931 ⎘