Roberto Suaya

High-frequency VLSI interconnect and intentional inductor impedance extraction in the presence of a multi-layer conductive substrate

High-frequency VLSI interconnect and intentional inductor impedance extraction in the presence of a multi-layer conductive substrate

Mutual inductance extraction using dipole approximations

Through-silicon via admittance extraction

Through silicon via impedance extraction

High-frequency VLSI interconnect and intentional inductor impedance extraction in the presence of a multi-layer conductive substrate

Determining mutual inductance between intentional inductors

Modeling the skin effect using efficient conduction mode techniques

Extracting high frequency impedance in a circuit design using an electronic design automation tool

High-frequency VLSI interconnect and intentional inductor impedance extraction in the presence of a multi-layer conductive substrate

Mutual inductance extraction using dipole approximations

Synthesis strategies based on the appropriate use of inductance effects

Modeling the skin effect using efficient conduction mode techniques

Extracting high frequency impedance in a circuit design using an electronic design automation tool

Extracting high frequency impedance in a circuit design using broadband representations

Determining mutual inductance between intentional inductors

Capacitance and transmission line measurements for an integrated circuit

Synthesis strategies based on the appropriate use of inductance effects

Capacitance measurements for an integrated circuit

Mutual inductance extraction using dipole approximations