Ichihara
Japan
5
2015-10-01
The entities that hold a legal rights for patent applications filed by inventor Katou Shinya:
Shinya Katou from Ichihara, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Tape for processing wafer, method for manufacturing tape for processing
#2 | 2013-10-17Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device
#3 | 2013-06-06Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method
#4 | 2012-07-05Adhesive sheet and method for manufacturing adhesive sheets
#5 | 2012-04-19Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device
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