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Inventor profile of:

Daisuke Sakuma

City:

Funabashi

Country:

Japan

Published Applications:

6

Last publication date:

2018-01-11

Top Assignees for applications by Daisuke Sakuma

The entities that hold a legal rights for patent applications filed by inventor Sakuma Daisuke:

  • NISSAN CHEMICAL INDUSTRIES, LTD. 6 Tokyo, Japan

Recent patent applications by Sakuma Daisuke

Daisuke Sakuma from Funabashi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-01-11
US20180010115A1
Chemistry; metallurgy

Ligand-binding fiber and cell culture substrate using said fiber

#2 | 2015-11-12
US20150322212A1
Chemistry; metallurgy

Composition for forming silicon-containing resist underlayer film having cyclic diester group

#3 | 2014-12-18
US20140370182A1
Chemistry; metallurgy

Organic silicon compound and silane coupling agent containing the same

#4 | 2014-06-19
US20140170855A1
Electricity

Silicon-containing resist underlayer film-forming composition having sulfone structure

#5 | 2013-11-14
US20130302991A1
Electricity

Composition for forming resist underlayer film, containing silicon that bears diketone-structure-containing organic group

#6 | 2013-08-22
US20130216956A1
Physics

Monolayer or multilayer forming composition

InventorID:

6361053 ⎘

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