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Inventor profile of:

Hideyuki Seto

City:

Miyoshi

Country:

Japan

Published Applications:

1

Last publication date:

2012-08-09

Top Assignees for applications by Hideyuki Seto

The entities that hold a legal rights for patent applications filed by inventor Seto Hideyuki:

TOYOTA JIDOSHA KABUSHIKI KAISHA 1 Toyota-shi, Japan

Recent patent applications by Seto Hideyuki

Hideyuki Seto from Miyoshi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-08-09

US20120200097A1

Performing operations; transporting

Mold structure and bumper

InventorID:

6362833 ⎘