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Inventor profile of:

David Wang

City:

Shanghai

Country:

China

Published Applications:

7

Last publication date:

2015-01-22

Top Assignees for applications by David Wang

The entities that hold a legal rights for patent applications filed by inventor Wang David:

  • ACM Research (Shanghai) Inc. 4 , China
  • ACM Research (Shanghai) Inc. 3 Shanghai, China
  • DOW GLOBAL TECHNOLOGIES LLC 1 Midland, MI United States

Recent patent applications by Wang David

David Wang from Shanghai, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-01-22
US20150025165A1
Chemistry; metallurgy

FOAMABLE COMPOSITIONS, FOAMS AND ARTICLES THEREOF

#2 | 2014-06-05
US20140154405A1
Electricity

Method to prewet wafer surface

#3 | 2014-02-06
US20140034094A1
Electricity

Methods and apparatus for cleaning semiconductor wafers

#4 | 2011-05-19
US20110114120A1
Electricity

Methods and apparatus for cleaning semiconductor wafers

#5 | 2010-12-09
US20100307913A1
Chemistry; metallurgy

Plating apparatus for metallization on semiconductor workpiece

#6 | 2010-09-23
US20100240226A1
Electricity

Method and apparatus for thermal treatment of semiconductor workpieces

#7 | 2009-04-30
US20090107846A1
Chemistry; metallurgy

Method and apparatus to prewet wafer surface for metallization from electrolyte solutions

InventorID:

636368 ⎘

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