Hiroko Asada

City:

Otsu

Country:

Japan

Published Applications:

Last publication date:

2013-01-24

Top Assignees for applications by Hiroko Asada

The entities that hold a legal rights for patent applications filed by inventor Asada Hiroko:

TOYO BOSEKI KABUSHIKI KAISHA 1 Osaka, Japan
Nippon Mektron, Ltd. 1 Tokyo, Japan

Recent patent applications by Asada Hiroko

Hiroko Asada from Otsu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2013-01-24

US20130020118A1

Chemistry; metallurgy

Resin composition for adhesive, adhesive containing resin composition for adhesive, adhesive sheet containing resin composition for adhesive, and printed wiring board including adhesive or adhesive sheet as adhesive layer

InventorID:

6373655 ⎘