Wei Mu

City:

Gansu

Country:

China

Published Applications:

Last publication date:

2013-12-19

Top Assignees for applications by Wei Mu

The entities that hold a legal rights for patent applications filed by inventor Mu Wei:

Wei Mu from Gansu, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Carrier-free land grid array IC chip package and preparation method thereof

Production method of high-density SIM card package

SiP system-integration IC chip package and manufacturing method thereof

InventorID:

6374005 ⎘