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Inventor profile of:

Hyuck Mo Lee

City:

Deajeon

Country:

South Korea

Published Applications:

1

Last publication date:

2015-06-04

Top Assignees for applications by Hyuck Mo Lee

The entities that hold a legal rights for patent applications filed by inventor Lee Hyuck Mo:

Korea Advanced Institute of Science and Technology 1 Daejeon, South Korea
KOREA ELECTRONICS TECHNOLOGY INSTITUTE 1 Gyeonggi-do, South Korea
Korea Institute of Industrial Technology 1 Chungcheongnam-do, South Korea
HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION 1 CHUNGCHEONGNAM-DO, South Korea
MK ELECTRON CO., LTD. 1 Gyeonggi-do, South Korea
Korea Institute of Industrial Technology 1 , South Korea
Korea Advanced Institute of Science and Technology 1 , South Korea
Korea Electronics Technology Institute 1 , South Korea
Hoseo University Academic Cooperation Foundation 1 , South Korea
MK Electron Co., Ltd. 1 , South Korea

Recent patent applications by Lee Hyuck Mo

Hyuck Mo Lee from Deajeon, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-06-04

US20150151386A1

Performing operations; transporting

Lead free solder bumps

InventorID:

6376087 ⎘