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Inventor profile of:

Boyi Yang

City:

Cary, North Carolina

Country:

United States

Published Applications:

6

Last publication date:

2017-08-10

Top Assignees for applications by Boyi Yang

The entities that hold a legal rights for patent applications filed by inventor Yang Boyi:

Silanna Asia Pte Ltd 3 Singapore, Singapore
Silanna Semiconductor U.S.A., Inc. 2 San Diego, CA United States
IO SEMICONDUCTOR, INC. 1 San Diego, CA United States

Recent patent applications by Yang Boyi

Boyi Yang from Cary, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2017-08-10

US20170229536A1

Power device on bulk substrate

#2 | 2016-11-24

US20160343802A1

Power device integration on a common substrate

#3 | 2014-10-02

US20140291762A1

Power device integration on a common substrate

#4 | 2014-02-06

US20140035102A1

Power device integration on a common substrate

#5 | 2014-02-06

US20140035047A1

Power device integration on a common substrate

#6 | 2014-02-06

US20140035032A1

Power device integration on a common substrate

InventorID:

637620 ⎘