David Borowsky

City:

Gerlingen

Country:

Germany

Published Applications:

Last publication date:

2014-02-06

Top Assignees for applications by David Borowsky

The entities that hold a legal rights for patent applications filed by inventor Borowsky David:

David Borowsky from Gerlingen, DE has applied for patents for these inventions. The list has both pending applications and granted patents:

Bonding pad for thermocompression bonding, process for producing a bonding pad and component

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, AND BONDING PAD

InventorID:

637763 ⎘