Hiroshi Okoshi

City:

Settsu

Country:

Japan

Published Applications:

Last publication date:

2015-07-02

Top Assignees for applications by Hiroshi Okoshi

The entities that hold a legal rights for patent applications filed by inventor Okoshi Hiroshi:

Hiroshi Okoshi from Settsu, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode

Curable resin composition, curable resin composition tablet, molded body, semiconductor package, semiconductor component and light emitting diode

InventorID:

6378616 ⎘