Komae
Japan
8
2017-06-15
The entities that hold a legal rights for patent applications filed by inventor Wang Shinan:
Shinan Wang from Komae, JP has applied for patents for these inventions. The list has both pending applications and granted patents:
Method of producing through wiring substrate and method of producing device
#2 | 2017-06-01Method for manufacturing through wiring substrate and method for manufacturing device
#3 | 2016-06-30Transducer device comprising an insulating film between a through wiring line and a semiconductor substrate
#4 | 2016-02-11Device with electrode connected to through wire, and method for manufacturing the same
#5 | 2015-09-17Device having element electrode connected to penetrating wire, and method for manufacturing the same
#6 | 2015-08-20Method of forming through wiring
#7 | 2015-07-02Capacitive transducer and method of manufacturing the same
#8 | 2015-03-05Method of manufacturing an ejection orifice member
6384065 ⎘