Honghui Wang

City:

Jiangsu

Country:

China

Published Applications:

Last publication date:

2017-07-20

Top Assignees for applications by Honghui Wang

The entities that hold a legal rights for patent applications filed by inventor Wang Honghui:

Honghui Wang from Jiangsu, CN has applied for patents for these inventions. The list has both pending applications and granted patents:

Structure and method of reinforcing a conductor soldering point of semiconductor device

Metal contact for semiconductor device

InventorID:

6399538 ⎘