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Inventor profile of:

Jae-Choon CHO

City:

Suwon-si

Country:

South Korea

Published Applications:

20

Last publication date:

2015-02-26

Top Assignees for applications by Jae-Choon CHO

The entities that hold a legal rights for patent applications filed by inventor CHO Jae-Choon:

SAMSUNG ELECTRO-MECHANICS CO., LTD. 7 Suwon-si, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 7 Suwon, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Gyunggi-do, South Korea
SAMSUNG ELECTRO-MECHANICS CO., LTD. 1 Suwon-si, Gyeonggi-do, South Korea

Recent patent applications by CHO Jae-Choon

Jae-Choon CHO from Suwon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2015-02-26

US20150056472A1

Laminate for Printed Circuit Board and Printed Circuit Board Using The Same

#2 | 2015-02-26

US20150053458A1

INSULATING FILM FOR PRINTED CIRCUIT BOARD AND PRODUCTS HAVING THE SAME

#3 | 2014-03-06

US20140065413A1

Insulating film and producing method for insulating film

#4 | 2014-02-06

US20140037889A1

INSULATOR FOR BUILD-UP PCB AND METHOD OF MANUFACTURING PCB USING THE SAME

#5 | 2013-12-12

US20130329336A1

Conductive paste composition for external electrode and multilayer ceramic electronic component fabricated using the same

#6 | 2012-05-03

US20120103507A1

Photosensitive composite and build-up insulation film with the photosensitive composite, and method for manufacturing circuit board using the build-up insulation film

#7 | 2012-03-29

US20120074430A1

Radiating substrate and method for manufacturing the radiating substrate, and luminous element package with the radiating substrate

#8 | 2012-03-15

US20120064231A1

Chemistry; metallurgy

Method for manufacturing printed circuit board including flame retardant insulation layer

#9 | 2011-12-29

US20110317382A1

Insulating resin composition and printed circuit substrate using the same

#10 | 2011-12-08

US20110298786A1

Color electronic paper display device and method for manufacturing the same

#11 | 2010-08-19

US20100210803A1

Chemistry; metallurgy

NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES AND INSULATING MATERIAL USING THE SAME

#12 | 2010-03-11

US20100063226A1

Chemistry; metallurgy

NORBORNENE-BASED POLYMER HAVING LOW DIELECTRIC CONSTANT AND LOW-LOSS PROPERTIES, AND INSULATING MATERIAL, PRINTED CIRCUIT BOARD AND FUNCTION ELEMENT USING THE SAME

#13 | 2010-02-25

US20100048858A1

Chemistry; metallurgy

Poly(-xylylene)-based polymer having low dielectric constant and low-loss property and insulating material, printed circuit board and functional element using the same

#14 | 2009-03-19

US20090072207A1

FLAME RETARDANT RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD USING THE SAME AND MANUFACTURING METHOD THEREOF

#15 | 2008-04-17

US20080090084A1

Chemistry; metallurgy

Flame retardant resin composition for printed circuit board and printed circuit board using the same

#16 | 2008-04-17

US20080086877A1

Manufacturing method for imprinting stamper

#17 | 2008-03-06

US20080057444A1

Method of manufacturing a broad stamper

#18 | 2008-02-14

US20080034581A1

Method for manufacturing printed circuit board

#19 | 2008-01-17

US20080012168A1

Performing operations; transporting

Method for manufacturing printed circuit board

#20 | 2008-01-10

US20080008824A1

Method for manufacturing printed circuit board using imprinting

InventorID:

640958 ⎘