Eiko Okamoto

City:

Mitsubishi

Country:

Japan

Published Applications:

Last publication date:

2014-02-06

Top Assignees for applications by Eiko Okamoto

The entities that hold a legal rights for patent applications filed by inventor Okamoto Eiko:

Mitsubishi Rayon Co., Ltd. 1 Tokyo, Japan

Recent patent applications by Okamoto Eiko

Eiko Okamoto from Mitsubishi, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2014-02-06

US20140037900A1

Performing operations; transporting

Active-Energy-Curable Resin Composition, Molding, Microrelief Structure, Water-Repellent Article, Mold, and Method for Producing Microrelief Structure

InventorID:

640975 ⎘