David J. Zapp

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Last publication date:

2017-02-02

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David J. Zapp from , has applied for patents for these inventions. The list has both pending applications and granted patents:

Securing mechanism and method for wafer bonder

Debonders with a recess and a side wall opening for semiconductor fabrication

Debonders with a recess and a heater for semiconductor fabrication

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6414643 ⎘