Ryosuke Kutsuna

City:

Nishio

Country:

Japan

Published Applications:

Last publication date:

2015-07-16

Top Assignees for applications by Ryosuke Kutsuna

The entities that hold a legal rights for patent applications filed by inventor Kutsuna Ryosuke:

Ryosuke Kutsuna from Nishio, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Sound absorbing cover, sound absorbing assembly, and magnetic induction foam molding device

InventorID:

6416492 ⎘