Hiroki Hatazawa

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2016-07-07

Top Assignees for applications by Hiroki Hatazawa

The entities that hold a legal rights for patent applications filed by inventor Hatazawa Hiroki:

Hiroki Hatazawa from Tokyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Layered body with support substrate, method for fabricating same, and method for fabricating multi-layer wiring substrate

InventorID:

6416766 ⎘