Hideyuki Wada

City:

Sakura

Country:

Japan

Published Applications:

Last publication date:

2021-03-04

Top Assignees for applications by Hideyuki Wada

The entities that hold a legal rights for patent applications filed by inventor Wada Hideyuki:

Hideyuki Wada from Sakura, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Wireless module

Multilayer substrate, multilayer substrate array, and transmission/ reception module

Optical element package

Imaging module, insulating-tube-attached imaging module, lens-attached imaging module, and endoscope

InventorID:

6427572 ⎘