Seiichi Kurihara

City:

Chikusei

Country:

Japan

Published Applications:

Last publication date:

2015-03-19

Top Assignees for applications by Seiichi Kurihara

The entities that hold a legal rights for patent applications filed by inventor Kurihara Seiichi:

Seiichi Kurihara from Chikusei, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Multilayer wiring board with metal foil wiring layer, wire wiring layer, and interlayer conduction hole

InventorID:

6427596 ⎘