Daisuke Tsuruga

City:

Nagaokakyo

Country:

Japan

Published Applications:

Last publication date:

2017-06-01

Top Assignees for applications by Daisuke Tsuruga

The entities that hold a legal rights for patent applications filed by inventor Tsuruga Daisuke:

Daisuke Tsuruga from Nagaokakyo, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Component-embedded substrate

Resin multilayer substrate and method of manufacturing the same

Production method of component-embedded substrate, and component-embedded substrate

InventorID:

6433501 ⎘