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Inventor profile of:

Tetsuya Maeyama

City:

Chikuma

Country:

Japan

Published Applications:

1

Last publication date:

2012-05-31

Top Assignees for applications by Tetsuya Maeyama

The entities that hold a legal rights for patent applications filed by inventor Maeyama Tetsuya:

APIC YAMADA CORPORATION 1 Chikuma-shi, Japan

Recent patent applications by Maeyama Tetsuya

Tetsuya Maeyama from Chikuma, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2012-05-31

US20120135096A1

Performing operations; transporting

Resin molding machine

InventorID:

6434228 ⎘