Tomoyuki Hakata

City:

Uji

Country:

Japan

Published Applications:

Last publication date:

2017-09-14

Top Assignees for applications by Tomoyuki Hakata

The entities that hold a legal rights for patent applications filed by inventor Hakata Tomoyuki:

Tomoyuki Hakata from Uji, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Bonded structure and method for producing bonded structure

Manufacturing method of bonding structure and bonding structure

Crimp structure, crimping method, and electronic device

Crimp structure, crimping method, and electronic device

InventorID:

6439536 ⎘