Eisuke Kodama

City:

Hitachinaka

Country:

Japan

Published Applications:

Last publication date:

2017-01-05

Top Assignees for applications by Eisuke Kodama

The entities that hold a legal rights for patent applications filed by inventor Kodama Eisuke:

Eisuke Kodama from Hitachinaka, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Semiconductor device including a fuse formed on a high thermal conductivity insulating film

InventorID:

6451155 ⎘