Koichi Sakabe

City:

Yao

Country:

Japan

Published Applications:

Last publication date:

2022-04-28

Top Assignees for applications by Koichi Sakabe

The entities that hold a legal rights for patent applications filed by inventor Sakabe Koichi:

Koichi Sakabe from Yao, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Hollow resin particles for thermosensitive recording media

Process for producing heat-expandable microspheres and application thereof

Heat-expandable microspheres, process for producing the same and application thereof

InventorID:

6461007 ⎘