Hsinchu
Taiwan
3
2019-01-17
The entities that hold a legal rights for patent applications filed by inventor Wang Hsueh-Te:
Hsueh-Te Wang from Hsinchu, TW has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor package including EMI shielding structure and method for forming the same
#2 | 2018-01-04Semiconductor chip package with resilient conductive paste post and fabrication method thereof
#3 | 2017-05-04Semiconductor package with coated bonding wires and fabrication method thereof
6462293 ⎘