Benjamin Wen-Jun Su

City:

Everett, Illinois

Country:

United States

Published Applications:

Last publication date:

2018-04-05

Top Assignees for applications by Benjamin Wen-Jun Su

The entities that hold a legal rights for patent applications filed by inventor Su Benjamin Wen-Jun:

The Boeing Company 1 Chicago, IL United States

Recent patent applications by Su Benjamin Wen-Jun

Benjamin Wen-Jun Su from Everett, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2018-04-05

US20180093431A1

Performing operations; transporting

Advanced variable radius laminated composite radius filler

InventorID:

6462978 ⎘