Dae Won Kim

City:

Icheon-si

Country:

South Korea

Published Applications:

Last publication date:

2017-12-28

Top Assignees for applications by Dae Won Kim

The entities that hold a legal rights for patent applications filed by inventor Kim Dae Won:

Dae Won Kim from Icheon-si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:

Method of manufacturing wafer level package and wafer level package manufactured thereby

InventorID:

6463310 ⎘