Jun Yoshida

City:

Ichihara

Country:

Japan

Published Applications:

Last publication date:

2021-09-16

Top Assignees for applications by Jun Yoshida

The entities that hold a legal rights for patent applications filed by inventor Yoshida Jun:

Jun Yoshida from Ichihara, JP has applied for patents for these inventions. The list has both pending applications and granted patents:

Block copolymer composition, heat shrink film using same, and package provided with heat shrink film

Resin composition containing block copolymer

InventorID:

6464718 ⎘